Hybrid Approaches to NEMS

Top-Down Approaches: Nanolithography, Etching, FIB, Nanoimprinting
Bottom-Up Approaches: CVD, Self-Assembly, Directed Self-Assembly, FIB, EBID, DPL
Hybrid Approaches to NEMS: A combination for NEMS devices

Enlarged view: NF-Nanofabrication, NA-Nanoassembly, PC-Property Characterization, NRM-Nanorobotic Manipulation
NF-Nanofabrication, NA-Nanoassembly, PC-Property Characterization, NRM-Nanorobotic Manipulation

Nanofabrication

  • E-beam Lithography: combining with PECVD for directed growth of vertically aligned nanotubes, and for nanoelectrodes for DEP assembly of lateral aligned nanotubes E-beam or Photo Lithography: combining with epitaxial deposition, spinning and etching for SiGe/Si bilayer nanocoils

Nanorobotic Manipulation

  • 3-D nanomanipulation in SEM and TEM: position and orientation
    In situ property characterization: mechanical, electric, electromechanical, etc.
    Nanostructuring: tailoring individual nanotubes
    Nanoassembly: vdW, EBID and nanomechanochemical bonding